E-2900 R6
Enterprise Computing Solutions with 3rd Generation Intel Xeon Scalable Ice Lake.
E-2900 R6 (12x3.5”)
UNICOM Engineering’s next-generation E-Series platforms are built on 3rd Gen Intel® Xeon® Scalable processors with support for the latest Intel Optane persistent memory, network adapters, and storage. UNICOM Engineering’s E-2900 R6 offers the performance and reliability of the 1U E-1800 R6 platforms but adds expansion capabilities via more I/O and accelerators, up to 9 expansion cards, additional drivers, and 12 hot-swap drives in a scalable 2U rackmount solution. Multiple configurations allow software and solution providers to customize the system solution to match high-density storage and I/O requirements while considering utilization requirements and overall value. Optimized for a variety of cloud, AI, and HPC workloads; customers can now build a greater variety of enterprise security, communications, video, and storage solutions as well as energy-efficient general-purpose data center building blocks.
Specification
- Up to two 16-to-32 Core Intel Xeon Ice Lake-SP CPUs
- Up to 32 DIMM slots, 16 per CPU with up to eight Intel Optane DC DIMMs per CPU with embedded RAID technology
- 12 SAS/SATA drive bays (supports up to four NVMe drives) with embedded RAID technology
- Up to eight PCIe Gen4 slots
- One OCP expansion module slot for up to 100 Gbe Ethernet support, five external USB 3.0/2.0 ports, one external DB-15 video port, one external RJ-45 serial port, one Integrated Baseboard Management Controller (BMC) with dedicated RJ45 remote management port, one Redundant 1300W AC Titanium or 1600W AC Titanium or 2100W AC Platinum Power Supply Units
E-2900 R6 (24x2.5”)
UNICOM Engineering’s next-generation E-Series platforms are built on 3rd Gen Intel® Xeon® Scalable processors with support for the latest Intel Optane persistent memory, network adapters, and storage. UNICOM Engineering’s E-2900 R6 offers the performance and reliability of the 1U E-1800 R6 platforms but adds expansion capabilities via more I/O and accelerators, up to 9 expansion cards, and 24 hot-swap drives in a scalable 2U rackmount solution. Multiple configurations allow software and solution providers to customize the system solution to match high-density storage and I/O requirements while considering utilization requirements and overall value. Optimized for a variety of cloud, AI, and HPC workloads; customers can now build a greater variety of enterprise security, communications, video, and storage solutions as well as energy-efficient general-purpose data center building blocks.
Specification
- Up to two 16-to-32 Core Intel Xeon Ice Lake-SP CPUs
- Up to 32 DIMM slots, 16 per CPU with up to 8 Intel Optane DC DIMMs per CPU with embedded RAID technology
- 24 SATA/NVMe SSD drive bays with embedded RAID technology
- Eight PCIe Gen4 slots, one OCP expansion module slot for up to 100Gbe Ethernet support
- Five external USB 3.0/2.0 ports, one external DB-15 video port, one external RJ-45 serial port, integrated Baseboard Management Controller (BMC) with dedicated RJ45 remote management port, redundant 1300W AC Titanium or 1600W AC Titanium or 2100W AC Platinum Power Supply Units
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