E-2900 R6
Enterprise Computing Solutions with 3rd Generation Intel Xeon Scalable Ice Lake.
UNICOM Engineering’s next-generation E-Series platforms are built on 3rd Gen Intel® Xeon® Scalable processors with support for the latest Intel Optane persistent memory, network adapters, and storage. UNICOM Engineering’s E-2900 R6 offers the performance and reliability of the 1U E-1800 R6 platforms but adds expansion capabilities via more I/O and accelerators, up to 9 expansion cards, additional drivers, and 12 hot-swap drives in a scalable 2U rackmount solution. Multiple configurations allow software and solution providers to customize the system solution to match high-density storage and I/O requirements while considering utilization requirements and overall value. Optimized for a variety of cloud, AI, and HPC workloads; customers can now build a greater variety of enterprise security, communications, video, and storage solutions as well as energy-efficient general-purpose data center building blocks.
Specification
- Up to two 16-to-32 Core Intel Xeon Ice Lake-SP CPUs
- Up to 32 DIMM slots, 16 per CPU with up to eight Intel Optane DC DIMMs per CPU with embedded RAID technology
- 12 SAS/SATA drive bays (supports up to four NVMe drives) with embedded RAID technology
- Up to eight PCIe Gen4 slots
- One OCP expansion module slot for up to 100 Gbe Ethernet support, five external USB 3.0/2.0 ports, one external DB-15 video port, one external RJ-45 serial port, one Integrated Baseboard Management Controller (BMC) with dedicated RJ45 remote management port, one Redundant 1300W AC Titanium or 1600W AC Titanium or 2100W AC Platinum Power Supply Units
UNICOM Engineering’s next-generation E-Series platforms are built on 3rd Gen Intel® Xeon® Scalable processors with support for the latest Intel Optane persistent memory, network adapters, and storage. UNICOM Engineering’s E-2900 R6 offers the performance and reliability of the 1U E-1800 R6 platforms but adds expansion capabilities via more I/O and accelerators, up to 9 expansion cards, and 24 hot-swap drives in a scalable 2U rackmount solution. Multiple configurations allow software and solution providers to customize the system solution to match high-density storage and I/O requirements while considering utilization requirements and overall value. Optimized for a variety of cloud, AI, and HPC workloads; customers can now build a greater variety of enterprise security, communications, video, and storage solutions as well as energy-efficient general-purpose data center building blocks.
Specification
- Up to two 16-to-32 Core Intel Xeon Ice Lake-SP CPUs
- Up to 32 DIMM slots, 16 per CPU with up to 8 Intel Optane DC DIMMs per CPU with embedded RAID technology
- 24 SATA/NVMe SSD drive bays with embedded RAID technology
- Eight PCIe Gen4 slots, one OCP expansion module slot for up to 100Gbe Ethernet support
- Five external USB 3.0/2.0 ports, one external DB-15 video port, one external RJ-45 serial port, integrated Baseboard Management Controller (BMC) with dedicated RJ45 remote management port, redundant 1300W AC Titanium or 1600W AC Titanium or 2100W AC Platinum Power Supply Units
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